The utility model relates to the field of module power supply, in particular to a pin device of a module power supply.

A power module pin device is a power supply that can be directly mounted on a printed circuit board, and is characterized by providing power for application specific integrated circuits (ASICs), digital signal processors (DSPs), microprocessors, memories, field programmable gate arrays (FPGAs), and other digital or analog loads. With the development of technology, power modules are developing in the direction of light, small, thin, low noise, high density, high reliability and anti-interference.

Small size SMT mount power module, its output voltage is low, in communication, transmission, access, routers and other equipment is widely used, widely used in single-board CPU, FPGA and other core devices to provide high current direct current coupling (Direct Coupled, referred to as DC) power supply. It is mostly packaged with SMT patches, which are directly mounted on the veneer through the SMT mounting process in production.

For the pins of the power module, the surface assembly technology (Surface Mounted Technology, referred to as SMT) is usually produced by centralizer fixture to ensure that multiple pins are vertical. However, the conventional centralizer fixture is integrated processing, and the drilling depth has certain processing errors, cannot be measured, and cannot guarantee the consistency of multiple hole depths. The module power supply is designed with blind holes. When solder paste is vaporized in a high-temperature molten state, the temperature in a high-temperature molten state is the existing common knowledge. The gas expands and blows up the pins, resulting in uneven pins of the module. The produced power module products account for 40% of the defective rate due to the coplanarity of the pins, resulting in low first pass rate of the overall product and more virtual soldering when the module is SMT mounted on the veneer. Fig. 1 is a cross-sectional view of the old-style single-plate drilling depth pin righting device in the relevant technology of the utility model. 101 is the righting device and 101a is the hole depth cross-sectional view. due to processing factors, its depth cannot reach the consistency of all hole depths. fig. 2 is a product diagram produced by the old-style scheme in the relevant technology of the utility model. the 201 is a product, 201a shows a schematic diagram of the product pins produced by the righting device of the old scheme (the scheme in the related technology). The solder paste is vaporized in a high-temperature molten state, and the gas expands, blowing up the pins and pushing them to the upper limit of the hole depth, resulting in multiple pins of the module being uneven.